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Low cure temperature (80°C) supported for temperature-sensitive materials
and is halogen-free (IEC 61249-2-21)
allowing uniform air flow throughout to evenly secure any substrate at all points
Head diameter — 2
Excellent printability and adhesion on paper substrates
T4 Solder Paste Sn42Bi57.6Ag0.4 Cartridges:1/Pack Low cure temperature (80°C) supportedDescription This lead free, RoHS compliant T4 tin bismuth solder paste is composed of 42% Tin, 57% Bismuth, and 0. 4% Silver. The addition of bismuth lowers the reflow temperature compared to other alloys, making it ideal for use with silver traces printed using the V One PCB printer. This solder paste is compatible with both V One printed boards and pre fabricated circuit boards. Specifications Particle size: T4 Alloy composition: Sn42Bi57. 6Ag0. 4
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